Semiconductor device and method of fabricating the same

ABSTRACT

A semiconductor device includes a stacked structure, openings passing through stacked structure, semiconductor patterns formed over inner walls of the openings, liner layers formed in the openings over the semiconductor patterns, and gap-fill insulating layers formed over the liner layers to fill the openings, wherein each of the gap-fill insulating layers seals an upper portion of the opening and includes at least one air gap.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.14/731,115 filed on Jun. 4, 2015, which claims priority to Korean patentapplication number 10-2015-0006343, filed on Jan. 13, 2015. Thedisclosure of each of the foregoing applications is herein incorporatedby reference in its entirety.

BACKGROUND Field of Invention

Various exemplary embodiments relate generally to an electronic deviceand a method of fabricating the same and, more particularly, to asemiconductor device having a three-dimensional structure and a methodof fabricating the same.

Description of Related Art

Non-volatile memory devices retain stored data with or without a powersupply. Two-dimensional memory devices having memory cells fabricated ina single layer over a silicon substrate have reached their limit when itcomes to increasing their degree of integration. Accordingly,three-dimensional non-volatile memory devices having memory cellsstacked in a vertical direction over a silicon substrate have beenproposed.

In a three-dimensional non-volatile memory device, gate electrodes andinsulating layers are stacked alternately with each other, and verticalchannel layers are formed therethrough, so that memory cells andselection transistors are stacked. However, since a plurality ofvertical channel layers are formed at the same time, manufacturingprocesses are complicated and manufacturing costs are increased. Inaddition, the memory cells and the selection transistors may havenon-uniform characteristics. More specifically, the selectiontransistors may have a wide threshold voltage distribution.

SUMMARY

An embodiment is directed to a semiconductor device includingtransistors having uniform characteristics and a method of fabricatingthe same.

A semiconductor device according to an embodiment may include a stackedstructure, openings passing through stacked structure, semiconductorpatterns formed over inner walls of the openings, liner layers formed inthe openings over the semiconductor patterns, and gap-fill insulatinglayers formed over the liner layers to fill the openings, wherein eachof the gap-fill insulating layers seals an upper portion of the openingand includes at least one air gap.

A method of fabricating a semiconductor device according to anembodiment may include forming a stacked structure, forming openings bypassing through the stacked structure, forming semiconductor patternsover an inner wall of the openings, and forming insulating patterns overthe semiconductor patterns to fill the openings, wherein each of theinsulating patterns seals an upper portion of the opening and includesat least one air gap.

A semiconductor device according to an embodiment may include a stackedstructure, openings passing through stacked structure, semiconductorpatterns formed over inner walls of the openings, and insulatingpatterns formed over the semiconductor patterns to fill the openings,wherein each of the insulating patterns seals an upper portion of theopening and includes at least one air gap.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are cross-sectional views of the structure of asemiconductor device according to an embodiment;

FIGS. 2A and 2B are cross-sectional views of a memory string of asemiconductor device according to an embodiment;

FIGS. 3A to 3D are cross-sectional views illustrating a method offabricating a semiconductor device according to an embodiment;

FIGS. 4A and 4B are cross-sectional views illustrating a method offabricating a semiconductor device according to an embodiment;

FIGS. 5 and 6 are block diagrams illustrating a memory system accordingto an embodiment; and

FIGS. 7 and 8 are block diagrams illustrating a memory system accordingto an embodiment.

DETAILED DESCRIPTION

Hereinafter, various exemplary embodiments of the present invention willbe described in detail with reference to the accompanying drawings. Inthe drawings, thicknesses and lengths of components are exaggerated forconvenience. In the following description, a detailed explanation ofknown related functions and constitutions may be omitted to avoidunnecessarily obscuring the subject manner. Like reference numeralsrefer to like elements throughout the specification and drawings.

FIGS. 1A and 1B are cross-sectional views of the structure of asemiconductor device according to an embodiment.

Referring to FIGS. 1A and 1B, the semiconductor device according to theembodiment may include a stacked structure ST, at least one opening OP,at least one semiconductor pattern 14 and at least one insulatingpattern ISP.

The stacked structure ST may include an insulating material, or firstmaterial layers 11 and second material layers 12 stacked alternatelywith each other. For example, the first material layers 11 may be gateelectrodes, such as a gate of a selection transistor and a gate of amemory cell, and include a conductive material. The second materiallayers 12 may be insulating layers which insulate the stacked gateelectrodes and include oxide or nitride. In another example, the firstmaterial layers 11 may be channel layers such as a channel layer of aselection transistor and a channel layer of a memory cell, and include asemiconductor material such as silicon (Si) or germanium (Ge). Thesecond material layers 12 may be insulating layers which insulate thestacked channel layers and include oxide or nitride.

At least one opening OP may pass through the stacked structure ST. Theopening OP may have various geometrical shapes such as circular,elliptical, rectangular, polygonal and linear cross-sections. Inaddition, the opening OP may have upper and lower portions whose widthsare substantially equal to each other. In other words, the upper andlower portions of the opening OP may have substantially the same widthas each other in a range allowing for process error. However, theopening OP may have a width decreasing from the upper portion to thelower portion, or may be uneven on an inner wall thereof.

At least one semiconductor pattern 14 may be formed in at least oneopening OP and formed on the inner wall of the opening OP. Thesemiconductor pattern 14 may have a predetermined thickness not tocompletely fill the opening OP and include silicon (Si) or germanium(Ge). A dielectric layer 13 may be further formed in the opening OP tosurround an outer wall of the semiconductor pattern 14. For example, thesemiconductor pattern 14 may be a channel layer, and the dielectriclayer 13 may be a memory layer. The memory layer may include at leastone of a tunnel insulating layer, a data storage layer and a chargeblocking layer. The data storage layer may include silicon, nitride,nanodots, or a phase-change material. In addition, although theembodiment shows that the dielectric layer 13 surrounds the outer wallof the semiconductor pattern 14, the dielectric layer 13 may have a Cshape to surround each of the first material layers 11, or a combinationthereof.

The insulating pattern ISP may be formed on the semiconductor pattern 14to fill the opening OP. In addition, the insulating pattern ISP may sealthe upper portion of the opening OP and include at least one air gap AG.The insulating pattern ISP may include a single layer or a plurality oflayers, depending on a width W1 and a width W2 of the opening OP. Forexample, when the width W1 of the opening OP is large, the insulatingpattern ISP may include a plurality of layers. When the width W2 of theopening OP is small, the insulating pattern ISP may include a singlelayer.

FIG. 1A illustrates that the width W1 of the opening OP is relativelylarge. The insulating pattern ISP may include a liner layer 15 and agap-fill insulating layer 16. The liner layer may be formed on thesemiconductor pattern 14 with a uniform thickness T1 so that the linerlayer 15 may not completely fill the opening OP. The gap-fill insulatinglayer 16 may be formed on the liner layer 15 to fill the opening OP andbe thick enough to seal the upper portion of the opening OP. Thegap-fill insulating layer 16 may have a thickness increasing from thelower portion to the upper portion of the opening OP.

The liner layer 15 or the gap-fill insulating layer 16 may include atleast one air gap AG. For example, the gap-fill insulating layer 16 maynot be formed in the lower portion of the opening OP. In this case, theair gap AG may be formed in the lower portion of the opening OP, and theliner layer 15 may be exposed by the air gap AG. However, thesemiconductor pattern 14 covered by the liner layer 15 may not beexposed.

The upper portion of the opening OP may be completely sealed by thegap-fill insulating layer 16 so that the air gap AG does not exist. Whena plurality of openings OP exist, the openings OP may be sealed atdifferent heights H1. In addition, the gap-fill insulating layers 16 mayinclude the air gaps AG having different heights. For example, a heightdifference AH1 may exist between a first air gap AG included in a firstgap-fill insulating layer 16 and a second air gap AG included in asecond gap-fill insulating layer 16.

When the upper portion of the opening OP is sealed by the gap-fillinsulating layer 16, impurities included in the gap-fill insulatinglayer 16 may be prevented from moving to the semiconductor pattern 14 bythe liner layer 15. In addition, since the semiconductor pattern 14 isnot exposed, agglomeration of the semiconductor pattern 14 may beprevented during manufacturing processes. Therefore, curing or heattreatment to prevent agglomeration of the semiconductor pattern 14 maybe omitted.

FIG. 1B illustrates that the width W2 of the opening OP is relativelysmall. The insulating pattern ISP may include the liner layer 15 formedon the semiconductor pattern 14 to fill the opening OP and sealing theupper portion of the opening OP.

The liner layer 15 may have a thickness T2 which increases from thelower portion to the upper portion of the opening OP, and include atleast one air gap AG.

When a plurality of openings OP exist, the openings OP may be sealed atdifferent heights H2. In addition, the air gaps AG included in the linerlayers 15 may have different heights. For example, a height differenceΔH2 may exist between the first air gap AG included in the first linerlayer 15 and the second air gap AG included in the second liner layer15.

When the liner layer 15 is formed on the semiconductor pattern 14 tofill the opening OP and seals the upper portion of the opening OP, aprocess of forming a gap-fill insulating layer may be skipped to therebysimplify manufacturing processes. In addition, since the semiconductorpattern 14 is not exposed, agglomeration of the semiconductor pattern 14may be prevented during manufacturing processes. Therefore, curing orheat treatment to prevent agglomeration of the semiconductor pattern 14may be omitted.

In another embodiment, a semiconductor device may include a conductivepattern instead of the semiconductor pattern 14. In this example, theconductive pattern may include polysilicon, tungsten, copper, titanium,tantalum, titanium nitride, tantalum nitride, or the like.

FIGS. 2A and 2B are cross-sectional views illustrating a memory stringof a semiconductor device according to an embodiment.

Referring to FIG. 2A, a stacked structure ST may include at least onelower selection gate electrode LSG, a plurality of control gateelectrodes CG and at least one upper selection gate electrode USG whichare stacked in a sequential manner, and include insulating layers ISinterposed therebetween. In the above-described stacked structure ST, atleast one lower selection transistor LST, a plurality of memory cells MCand at least one upper selection transistor UST may be coupled in seriesto form a single memory string.

At least one opening OP may pass through the stacked structure ST. Adielectric layer DI, a channel layer CH, an insulating pattern ISP, anair gap AG and a conductive plug P may be formed in the opening OP. Thechannel layer CH may be straight, and the insulating pattern ISP mayhave the shape described above with reference to FIGS. 1A and 1B. Theair gap AG may be located in the insulating pattern ISP and bepositioned at a level lower than the upper selection gate electrode USG.The conductive plug P may be formed in the opening OP on the insulatingpattern ISP to cap an entry of the opening OP and partially overlap withthe upper selection gate electrode USG. For example, a lower surface ofthe conductive plug P may be located between an upper surface and alower surface of the upper selection gate electrode USG.

In addition, the plurality of conductive plugs P formed in the pluralityof openings OP may have a uniform height. The plurality of conductiveplugs P may include junctions of the upper selection transistors UST atregions overlapping with the upper selection gate electrodes USG.Therefore, the junctions may also be located at a uniform height. As aresult, the upper selection transistors UST may have uniform thresholdvoltage characteristics.

Referring to FIG. 2B, a stacked structure ST may include a pipe gateelectrode PG, control gate electrodes CG and one or more selection gateelectrodes SG1 and SG2 which are stacked in a sequential manner, andinclude insulating layers IS interposed therebetween. In theabove-described stacked structure ST, at least one first selectiontransistor ST1, a plurality of memory cells MC, a pipe transistor PT, aplurality of memory cells MC and at least one second selectiontransistor ST2 may be coupled in series to form a single memory string.

An opening OP may pass through the stacked structure ST and have a Ushape. A dielectric layer DI, a channel layer CH, an insulating patternISP, an air gap AG and conductive plugs P may be located in the openingOP. The channel layer CH may have a U shape. For example, the channellayer CH may include at least two vertical patterns passing through thestacked structure ST in a vertical direction and a coupling patterncoupling the vertical patterns. The insulating pattern ISP may include afirst air gap formed in the coupling pattern and at least one second airgap formed in the vertical patterns. In addition, the first air gap mayextend to lower portions of the vertical patterns. The air gap AG may bepositioned at a level lower than the first and second selection gateelectrodes SG1 and SG2. The conductive plugs P may be formed in theopening OP on the insulating pattern ISP to cap an entry of the openingOP. A lower surface of the conductive plug P may be located betweenupper and lower surfaces of the first and second selection gateelectrodes SG1 and SG2.

In addition, the conductive plugs P may have a uniform height.Therefore, junctions of the first and second selection transistors ST1and ST2 may be located at a uniform height, so that the first and secondselection transistors ST1 and ST2 may have uniform threshold voltagecharacteristics.

FIGS. 3A to 3D are cross-sectional views illustrating a method offabricating a semiconductor device according to an embodiment.

Referring to FIG. 3A, first material layers 21 and second materiallayers 22 may be stacked alternately with each other to form a stackedstructure. The first material layers 21 may include a material having anetch selectivity to the second material layers 22. For example, thefirst material layers 21 may be sacrificial layers including nitride,and the second material layers 22 may be insulating layers includingoxide. In another example, the first material layers 21 may beconductive layers including doped polysilicon, doped amorphous silicon,or the like, and the second material layers 22 may be sacrificial layersincluding undoped polysilicon, undoped amorphous silicon, or the like.In another example, the first material layers 21 may be conductivelayers including doped polysilicon or doped amorphous silicon, and thesecond material layers 22 may be insulating layers including oxide.According to an embodiment, a description is made in reference to anexample in which the first material layers 21 include sacrificial layersand the second material layers 22 include insulating layers.

Subsequently, the opening OP may be formed by passing through the firstand second material layers 21 and 22. The opening OP may have arelatively large width W1. The opening OP may have various geometricalshapes such as circular, elliptical, rectangular, polygonal and linearcross-sections.

A dielectric layer 23 and a semiconductor pattern 24 may be formed on aninner wall of the opening OP not to completely fill the opening OP. Thedielectric layer 23 may include at least one of a charge blocking layer,a data storage layer and a tunnel insulating layer. The data storagelayer may include silicon, nitride, a phase-change material or nanodots.In addition, the semiconductor pattern 24 may include silicon (Si),germanium (Ge) or the like.

Referring to FIGS. 3B and 3C, after a liner layer 25 is formed on thesemiconductor pattern 24 not to completely fill the opening OP, agap-fill insulating layer 26 may be formed on the liner layer 25 to fillthe opening OP and seal an upper portion of the opening OP. The linerlayer 25 may have a predetermined thickness by which the liner layer 25may not completely fill the opening OP. The gap-fill insulating layer 26may be thick enough to completely fill the upper portion of the openingOP. The gap-fill insulating layer 26 may also be formed on an uppersurface of the stacked structure.

The liner layer 25 may be formed by a deposition method to have betterstep coverage than the gap-fill insulating layer 26. In addition, thegap-fill insulating layer 26 may be formed at a higher deposition ratethan the liner layer 25. As a result, the liner layer 25 may be formedon the semiconductor pattern 24 with a uniform thickness. In addition,the gap-fill insulating layer 26 may completely seal the upper portionof the opening OP without the air gap AG and include the air gap AGlocated in a lower portion of the opening OP.

For example, the liner layer 25 may be formed by an Atomic LayerDeposition (ALD) method or a Chemical Vapor Deposition (CVD) method, andthe gap-fill insulating layer 26 may be formed by an Atomic LayerDeposition (ALD) method, a Chemical Vapor Deposition (CVD) method, or aHigh Aspect Ratio Process (HARP) method.

Referring to FIG. 3D, a gap-fill insulating pattern 26A may be formed byetching the gap-fill insulating layer 26 until an upper portion of thesemiconductor pattern 24 is exposed. As a result, the opening OP mayhave a re-opened area, and a conductive plug 27 may be formed in there-opened area of the opening OP. Since the upper portion of the openingOP is completely sealed by the gap-fill insulating layer 26 without theair gap AG, even when the gap-fill insulating layers 26 formed in theplurality of openings OP are etched at the same time, the gap-fillinsulating layers 26 may be etched to a uniform depth. Therefore, theconductive plugs 27 may have a uniform height.

After a slit (not illustrated) is formed by etching the first and secondmaterial layers 21 and 22, the first material layers 21 may be removedusing the slit. Subsequently, conductive layers 28 may be formed inregions from which the first material layers 21 are removed. Before theconductive layers 28 are formed, dielectric layers (not illustrated) maybe further formed in the regions from which the first material layers 21are removed. Thus, the dielectric layers may surround the conductivelayers 28, respectively, in a “C” shape.

However, the above-described manufacturing processes may be changeddepending on materials of the first and second material layers 21 and22. For example, when the first material layers 21 include conductivelayers and the second material layers 22 include sacrificial layers,insulating layers may be formed after the second material layers 22 areremoved using the slit. In addition, when the first material layers 21include conductive layers and the second material layers 22 includeinsulating layers, the first material layers 21 may be silicided usingthe slit.

FIGS. 4A and 4B are cross-sectional views illustrating a method offabricating a semiconductor device according to an embodiment.Repetitive descriptions of structures described above will be omitted.

Referring to FIG. 4A, after first and second material layers 41 and 42are formed, the opening OP may be formed by passing through the firstand second material layers 41 and 42. The opening OP may have arelatively small width W2. Subsequently, a dielectric layer 43 and asemiconductor pattern 44 may be formed on an inner wall of the openingOP not to completely fill the opening OP.

Referring to FIG. 4B, a liner layer 45 may be formed on thesemiconductor pattern 44 to fill the opening OP. The liner layer 45 maybe formed on the semiconductor patterns 44 to seal an upper portion ofthe opening OP. The liner layer 45 may be partially etched to re-openthe upper portion of the opening OP, and a conductive plug 46 may beformed to fill the re-opened area of the opening OP.

Subsequently, a slit (not illustrated) may be formed by etching thefirst and second material layers 41 and 42. The first material layers 41may be replaced by conductive layers 47 using the slit.

According to the embodiment, since the opening OP has the relativelysmall width W2, the upper portion of the opening OP may be sealed onlyby the liner layer 45. Therefore, a process of forming a gap-fillinsulating layer may be skipped.

FIG. 5 is a block diagram illustrating a memory system according to anembodiment.

As illustrated in FIG. 5, the memory system 1000 according to theembodiment may include a memory device 1200 and a controller 1100.

The memory device 1200 may be used to store various types of data suchas text, graphic, and software code.

The memory device 1200 may be a non-volatile memory and include thestructure described above and shown in FIGS. 1A to 4B. In addition, thememory device 1200 may include a stacked structure, openings passingthrough the stacked structure, semiconductor patterns formed over innerwalls of the openings, and insulating patterns formed over thesemiconductor patterns to fill the opening, each sealing an upperportion of the opening and including at least one air gap. Since thememory device 1200 is configured and manufactured in the above-describedmanner, a detailed description thereof will be omitted.

The controller 1100 may be coupled to a host and the memory device 1200,and may access the memory device 1200 in response to a request from thehost. For example, the controller 1100 may control read, write, eraseand background operations of the memory device 1200.

The controller 1100 may include a random access memory (RAM) 1110, acentral processing unit (CPU) 1120, a host interface 1130, an errorcorrection code (ECC) circuit 1140 and a memory interface 1150.

The RAM 1110 may serve as an operation memory of the CPU 1120, a cachememory between the memory device 1200 and the host, and a buffer memorybetween the memory device 1200 and the host. The RAM 1110 may bereplaced by a static random access memory (SRAM) or a read only memory(ROM).

The CPU 1120 may be configured to control the general operation of thecontroller 1100. For example, the CPU 1120 may be configured to operatefirmware such as a flash translation layer (FTL) stored in the RAM 110.

The host interface 1130 may interface with the host. For example, thecontroller 1100 may communicate with the host through various interfaceprotocols including a Universal Serial Bus (USB) protocol, a multimediacard (MMC) protocol, a peripheral component interconnection (PCI)protocol, a PCI-express (PCI-E) protocol, an Advanced TechnologyAttachment (ATA) protocol, a Serial-ATA protocol, a Parallel-ATAprotocol, a small computer small interface (SCSI) protocol, an enhancedsmall disk interface (ESDI) protocol, an Integrated Drive Electronics(IDE) protocol, a private protocol, or a combination thereof.

The ECC circuit 1140 may detect and correct errors included in datawhich is read from the memory device 1200, by using error correctioncodes (ECCs).

The memory interface 1150 may interface with the memory device 1200. Forexample, the memory interface 1150 may include a NAND interface or a NORinterface.

For example, the controller 1100 may further include a buffer memory(not illustrated) configured to temporarily store data. The buffermemory may temporarily store data externally transferred through thehost interface 1130, or temporarily store data transferred from thememory device 1200 through the memory interface 1150. The controller1100 may further include ROM storing code data to interface with thehost.

Since the memory system 1000 according to the embodiment includes thememory device 1200 having improved structural stability and simplifiedmanufacturing processes, characteristics of the memory system 1000 mayalso be improved.

FIG. 6 is a block diagram illustrating a memory system according to anembodiment. Hereinafter, descriptions of components already mentionedabove are omitted.

As illustrated in FIG. 6, the memory system 1000′ according to theembodiment may include a memory device 1200′ and the controller 1100.The controller 1100 may include the RAM 1110, the CPU 1120, the hostinterface 1130, the ECC circuit 1140 and the memory interface 1150.

The memory device 1200′ may be a non-volatile memory device. The memorydevice 1200′ may include the memory strings described above withreference to FIGS. 1A to 4B. In addition, the memory device 1200′ mayinclude a stacked structure, openings passing through the stackedstructure, semiconductor patterns formed over inner walls of theopenings, and insulating patterns formed over the semiconductor patternsto fill the opening, each sealing an upper portion of the opening andincluding at least one air gap. Since the memory device 1200′ isconfigured and manufactured in the above-described manner, a detaileddescription thereof will be omitted.

The memory device 1200′ may be a multi-chip package composed of aplurality of memory chips. The plurality of memory chips may be dividedinto a plurality of groups. The plurality of groups may communicate withthe controller 1100 through first to k-th channels CH1 to CHk,respectively. In addition, memory chips, included in a single group, maybe suitable for communicating with the controller 1100 through a commonchannel. The memory system 1000′ may be modified so that a single memorychip may be coupled to a single channel.

As described above, according to the embodiment, since the memory system1000′ includes the memory device 1200′ having improved structuralstability and simplified manufacturing processes, characteristics of thememory system 1000′ may also be improved. In addition, since the memorydevice 1200′ is formed using a multi-chip package, data storage capacityand driving speed of the memory system 1000′ may be further increased.

FIG. 7 is a block diagram illustrating a computing system according toan embodiment. Hereinafter, descriptions of components already mentionedabove are omitted.

As illustrated in FIG. 7, the computing system 2000 according to theembodiment may include a memory device 2100, a CPU 2200, a random-accessmemory (RAM) 2300, a user interface 2400, a power supply 2500 and asystem bus 2600.

The memory device 2100 may store data, which is input through the userinterface 2400, and data, which is processed by the CPU 2200. The memorydevice 2100 may be electrically coupled to the CPU 2200, the RAM 2300,the user interface 2400, and the power supply 2500. For example, thememory device 2100 may be coupled to the system bus 2600 through acontroller (not illustrated) or be directly coupled to the system bus2600. When the memory device 2100 is directly coupled to the system bus2600, the CPU 2200 and the RAM 2300 may serve as the controller.

The memory device 2100 may be a non-volatile memory. The memory device2100 may be the memory string described above with reference to FIGS. 1Ato 4B. The memory device 2100 may include a stacked structure, openingspassing through the stacked structure, semiconductor patterns formedover inner walls of the openings, and insulating patterns formed overthe semiconductor patterns to fill the opening, each sealing an upperportion of the opening and including at least one air gap. Since thememory device 2100 is configured and manufactured in the same manner asdescribed above, a detailed description thereof will be omitted.

In addition, as described above with reference to FIG. 6, the memorydevice 2100 may be a multi-chip package composed of a plurality ofmemory chips.

The computing system 2000 having the above-described configuration maybe one of various components of an electronic device, such as acomputer, an ultra-mobile PC (UMPC), a workstation, a net-book, personaldigital assistants (PDAs), a portable computer, a web tablet, a wirelessphone, a mobile phone, a smart phone, an e-book, a portable multimediaplayer (PMP), a portable game machine, a navigation device, a black box,a digital camera, a three-dimensional (3D) television, a digital audiorecorder, a digital audio player, a digital picture recorder, a digitalpicture player, a digital video recorder, a digital video player, adevice for transmitting/receiving information in wireless environments,one of various electronic devices for home networks, one of variouselectronic devices for computer networks, one of various electronicdevices for telematics networks, an RFID device, and/or one of variousdevices for computing systems, etc.

As described above, since the computing system 2000 according to theembodiment includes the memory device 2100 having improved structuralstability and simplified manufacturing processes, characteristics of thecomputing system 2000 may be improved.

FIG. 8 is a block diagram illustrating a computing system according toan embodiment.

As illustrated in FIG. 8, a computing system 3000 according to theembodiment may include a software layer that has an operating system3200, an application 3100, a file system 3300, and a translation layer3400. The computing system 3000 may include a hardware layer such as amemory device 3500.

The operating system 3200 may manage software and hardware resources ofthe computing system 3000. The operating system 3200 may control programexecution of a central processing unit. The application 3100 may includevarious application programs executed by the computing system 3000. Theapplication 3100 may be a utility executed by the operating system 3200.

The file system 3300 may refer to a logical structure configured tomanage data and files present in the computing system 3000. The filesystem 3300 may organize files or data and store them in the memorydevice 3500 according to given rules. The file system 3300 may bedetermined depending on the operating system 3200 that is used in thecomputing system 3000. For example, when the operating system 3200 is a

Microsoft Windows-based system, the file system 3300 may be a fileallocation table (FAT) or an NT file system (NTFS). In addition, whenthe operating system 3200 is a Unix/Linux-based system, the file system3300 may be an extended file system (EXT), a Unix file system (UFS) or ajournaling file system (JFS).

FIG. 8 illustrates the operating system 3200, the application 3100, andthe file system 3300 in separate blocks. However, the application 3100and the file system 3300 may be included in the operating system 3200.

The translation layer 3400 may translate an address suitable for thememory device 3500 in response to a request from the file system 3300.For example, the translation layer 3400 may translate a logic address,generated by the file system 3300, into a physical address of the memorydevice 3500.

Mapping information of the logic address and the physical address may bestored in an address translation table. For example, the translationlayer 3400 may be a flash translation layer (FTL), a universal flashstorage link layer (ULL), or the like.

The memory device 3500 may be a non-volatile memory. The memory device3500 may be the semiconductor memory device described above and shown inFIGS. 1A to 4B. The memory device 3500 may include a stacked structure,openings passing through the stacked structure, semiconductor patternsformed over inner walls of the openings, and insulating patterns formedover the semiconductor patterns to fill the opening, each sealing anupper portion of the opening and including at least one air gap. Sincethe memory device 3500 is configured and manufactured the same as thememory devices 1200, 1200′ or 2100, a detailed description thereof willbe omitted.

The computing system 3000 having the above-described configuration maybe divided into an operating system layer that is operated in an upperlayer region and a controller layer that is operated in a lower levelregion. The application 3100, the operating system 3200, and the filesystem 3300 may be included in the operating system layer and driven byan operation memory. The translation layer 3400 may be included in theoperating system layer or the controller layer.

As described above, since the computing system 3000 according to theembodiment includes the memory device 3500 having improved structuralstability and simplified manufacturing processes, characteristics of thecomputing system 2000 may be improved.

In accordance with the present invention, a semiconductor device mayinclude insulating patterns formed on semiconductor patterns to sealupper portions of openings. Since the semiconductor patterns are notexposed, agglomeration of the semiconductor patterns may be prevented.Thus, curing or heat treatment to avoid agglomeration of thesemiconductor patterns may be skipped. In addition, since the upperportions of the openings are completely sealed by the insulatingpatterns, conductive patterns may be formed to a uniform depth.

What is claimed is:
 1. A method of fabricating a semiconductor device,the method comprising: forming a stacked structure; forming openings bypassing through the stacked structure; forming semiconductor patterns inthe openings; and forming insulating patterns in the semiconductorpatterns to fill the openings, wherein each of the insulating patternsseals an upper portion of each of the opening and includes at least oneair gap.
 2. The method of claim 1, wherein each of the openings has theupper portion and a lower portion whose widths are substantially equalto each other.
 3. The method of claim 1, wherein the forming of theinsulating patterns comprises: forming liner layers in the semiconductorpatterns; and forming gap-fill insulating layers in the liner layers tofill the openings and seal upper portions of the openings.
 4. The methodof claim 3, wherein the forming of the liner layers is performed by adeposition method and has better step coverage than the forming of thegap-fill insulating layers.
 5. The method of claim 3, wherein theforming of the gap-fill insulating layers is performed at a higherdeposition rate than the forming of the liner layers.
 6. The method ofclaim 3, wherein the forming of the liner layers is performed by anAtomic Layer Deposition (ALD) method or a Chemical Vapor Deposition(CVD) method.
 7. The method of claim 3, wherein the forming of thegap-fill insulating layers is performed by an Atomic Layer Deposition(ALD) method, a Chemical Vapor Deposition (CVD) method, or a High AspectRatio Process (HARP) method.
 8. The method of claim 1, wherein theforming of the insulating patterns comprises: forming liner layers inthe semiconductor patterns to fill the openings, wherein the linerlayers seal upper portions of the openings, and each of the liner layersincludes the air gap.
 9. The method of claim 1, further comprising:partially etching the insulating patterns to form a re-opened area ofthe openings; and forming conductive plugs in the re-opened area of theopenings.
 10. The method of claim 9, wherein the conductive plugs have auniform height.
 11. The method of claim 1, wherein the forming of thestacked structure comprises: forming first material layers and secondmaterial layers that are alternately stacked on each other, wherein atop of an uppermost air gap among the at least one air gap is located ata lower level than a bottom of an uppermost first material layer amongthe first material layers and is located at a higher level than a top ofa lowermost first material layer among the first material layers. 12.The method of claim 11, further comprising: replacing the first materiallayers by conductive layers.
 13. The method of claim 12, wherein theconductive layers include a plurality of control gate electrodes and atleast one selection gate electrode over the plurality of control gateelectrodes.
 14. A method of fabricating a semiconductor device, themethod comprising: forming a stacked structure; forming openings bypassing through the stacked structure; forming semiconductor patterns inthe openings; and forming insulating patterns in the semiconductorpatterns to fill the openings, wherein each of the insulating patternsseals an upper portion of an opening and includes at least one air gap,and wherein the stacked structure includes conductive layers andinsulating layers that are alternately stacked, and a top of anuppermost air gap among the at least one air gap is located at a lowerlevel than a bottom of an uppermost conductive layer among theconductive layers and is located at a higher level than a top of alowermost conductive layer among the conductive layers.
 15. The methodof claim 14, wherein the uppermost air gap does not overlap theuppermost conductive layer as viewed in a cross section.
 16. The methodof claim 14, wherein the insulating patterns include: liner layersformed in respective channel patterns; and gap-fill insulating layersformed in the liner layers to seal upper portions of the openings.